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Translation for thechnical paper (5,000 points / 250 words)
Descrizioni
日本語の技術論文の英文翻訳を手伝ってほしい方へ
私は今までに 学会発表用の日本語の論文を英訳した経験があります。
２０００年 IEMT/IMC Symposium 論文翻訳 ”Outstanding Technical Paper Award"受賞
２０１０年 ６０th Electronics Components and Technology Conference (ECTC) 学会発表用論文翻訳、プレゼンテーション原稿翻訳、”Best Session Award”受賞
２０１１年 IEEE Transactions on Components, packaging, and Manufacturing Technology 論文掲載 (２０１０年のECTC受賞の論文）
２０１３年 ６３rd ECTC 学会発表用論文翻訳 プレゼンテーション原稿翻訳
以下に私が翻訳した論文の一部を紹介します
This paper introduces a newly-developed Nano-Silica Composite Laminate packaging technology that utilizes a Nano-silica matrix composite material with outstanding properties. Nano-Silica Composite Laminate packaging technology enables us to create a thinner, downsized packaging that is less susceptible to warpage.
In order to verify the advantageous properties of Nano-Silica Composite Laminate, we measured the degree of warpage by utilizing a dielectric test substrate that was composed of Nano-Silica Composite Laminate and resin films. The results obtained in this study demonstrated that the dielectric material created using Nano-Silica Composite Laminate allows us to avoid the resin’s undesirable tendency of allowing the coefficient of thermal expansion (CTE) to increase when the temperature rises beyond the glass transition temperature. The storage modulus of Nano-Silica Composite Laminate showed 30 GPa, which is more than five times higher than that of ordinary resin. Therefore, we were able to confirm that using Nano-Silica Composite Laminate contributes to decreasing warpage of the conventional substrate during the packaging process. Furthermore, we confirmed that the test substrate has the following extremely reliable properties: it can maintain both conductivity and dielectricity under the conditions of both a line/space width of 10/10µm and a via diameter of 30 µm.
Consequently, through the test results it has been confirmed that Nano-Silica Composite Laminate is one of the most appropriate substrates available to strengthen the interconnection between a silicon chip and substrate, and to protect the large-scale integrated (LSI) circuits from breaking.
私に翻訳のお手伝いを 依頼してくださったら、正確を期する為に日本語の論文の詳細な 実験状況、条件等をレッスン時間内に伺って、その後、一文ずつ丁寧に翻訳し、さらに知り合いのnative speakers of Englishにチェックしてもらって 返信致します。
自分の力量外のものに関しては、お断りすることもありますので、予めご了承くださいますように、お願い致します。
また、学会発表用の論文は、未発表の内容でしょうから、企業秘密は絶対厳守いたします。
＊注意事項＊翻訳から精査、ネイティブチェックまでをご希望される方は、少なくとも１０日から２週間前に、日本語の原稿をお渡しくださいますようにお願いいたします。
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